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陶瓷封装激光打标工艺研究
引用本文:陈陶,郭伟.陶瓷封装激光打标工艺研究[J].电子与封装,2013(8):14-16,33.
作者姓名:陈陶  郭伟
作者单位:无锡中微高科电子有限公司,江苏无锡,214035
摘    要:激光打标作为一种新型的标记技术,在半导体行业有着愈发重要的应用。文章简单介绍了激光打标机原理及控制系统,并通过对陶瓷封装过程中镀镍柯伐盖板表面的打标工艺试验及结果分析,研究了激光功率、频率、速度、延时等参数对标记效果的影响。研究结果表明,激光功率和速度对标记效果的影响呈线性规律,频率无线性规律可寻,但存在一最佳值区域;延时参数的设置不当会导致某些点标记过重或线条缺笔、字符变形等。

关 键 词:激光打标  陶瓷封装  激光打标参数

Research of Laser Marking Process for Ceramic Packaging
CHEN Tao , GUO Wei.Research of Laser Marking Process for Ceramic Packaging[J].Electronics & Packaging,2013(8):14-16,33.
Authors:CHEN Tao  GUO Wei
Affiliation:( Wuxi Zhongwei High-tech Electronics Co., Ltd, Wuxi 214035, China)
Abstract:As a new type of marking technology, laser marking has the more important applications in semiconductor industry. This article introduces the theory and control systems of laser marker briefly, and analyzes the marking effects by the experiments of the laser marking parameters such as power, frequency, speed and delay on nickel-plated Kovar lid. The research shows that the marking effects of laser power and speed present linear rule, frequency doesn't present linear rule but exists the best area; the improper settings of delay parameter cause some marking points too deep, lost or make the characters deformation and so on.
Keywords:laser marking  ceramic package  laser marking parameters
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