| 软钎焊钎料的最新发展动态 |
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| 引用本文： | 石素琴,董占贵,钱乙余.软钎焊钎料的最新发展动态[J].电子工艺技术,2000,21(6):231-234. |
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| 作者姓名： | 石素琴 董占贵 钱乙余 |
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| 作者单位： | 哈尔滨工业大学现代焊接生产技术国家重点实验室,黑龙江,哈尔滨,150001 |
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| 摘 要： | 随着微电子表面组装技术的迅猛发展 ,软钎料尤其是无铅钎料逐渐成为研究的焦点。叙述了IBSC2 0 0 0国际钎焊会议上有关国内外软钎料发展的最新动态
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| 关 键 词： | 表面组装技术 软钎焊 无铅钎料 |
The New Development in Solder Alloys |
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| SHI Su-qin,DONG Zhan-gui,QIAN Yi-yu.The New Development in Solder Alloys[J].Electronics Process Technology,2000,21(6):231-234. |
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| Authors: | SHI Su-qin DONG Zhan-gui QIAN Yi-yu |
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| Abstract: | The solder alloys especially the lead-free solder alloys become the focus of study because of the quick development of the microelectronics and the surface mount technology (SMT).This paper gives an account of the latest development of IBSC2000 in soldering home and abroad. |
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| Keywords: | SMT Soldering Lead-free solder |
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