Angular dependence of sputtering effects by ethanol cluster ion irradiation on solid surfaces

In order to clarify the interactions of ethanol cluster ions with solid surfaces such as Si(100), SiO₂ and Au surfaces, sputtering effects were investigated by changing the acceleration voltage and incident angle (θ) of the cluster ions. The sputtered depth at a normal incidence of θ = 0° increased with an increase of the acceleration voltage. The sputtering ratio of Si to SiO₂ was approximately 10, which suggested that chemical reactions between Si and ethanol produced silicon hydride as a dominant etching material. Furthermore, the sputtered depth of Si surfaces by ethanol cluster ion irradiation had a maximum value at an incident angle between 10° and 60°, and the angle corresponding to the maximum peak increased with an increase of the acceleration voltage. On the other hand, for the physical sputtering of Au surfaces by ethanol cluster ion irradiation, the sputtered depth decreased with the increase of the incident angle, and the change was in accordance with cos θ.With regards to the angular distribution of sputtered particles, Si surface atoms were ejected by ethanol cluster ion irradiation according to a cosine law distribution. This indicated that the Si surfaces were chemically sputtered by ethanol cluster ion irradiation. On the other hand, for the case of Au surfaces, the ejection of the sputtered particles changed to the under-cosine law. This was ascribed to the lateral sputtering effect of ethanol cluster ion irradiation.