Effects of Bi and Pb on oxidation in humidity for low-temperature lead-free solder systems |
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Authors: | Keun-Soo Kim Toshinori Matsuura Katsuaki Suganuma |
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Affiliation: | (1) Institute of Scientific and Industrial Research, Osaka University, 567-0047 Ibaraki, Osaka, Japan |
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Abstract: | The oxidation behavior of various Sn-Zn(-Bi) alloys during 60°C/90% and 85°C/85% relative humidity (RH) exposure were investigated
by microstructure observation and x-ray diffraction analysis. The mechanical property of the joints of resistor chips (1608R)
with two kinds of terminations, Sn and Sn-10Pb, soldered on a printed circuit board with Sn-Zn(-Bi) were evaluated by a shear
test. The heat/humidity exposure of Sn-Zn alloys promotes segregation into the grain boundary accompanying oxidation of Zn
resulting in the ZnO formation. This segregation induces serious degradation of alloys and Sn whisker growth. Heat/humidity
exposure of 85°C/85%RH seriously decreases the shear strength of the surface mounted chip joints, especially Sn-Zn-Bi solder,
due to the formation of ZnO at the interface between the solder and the reaction layer. The presence of Bi or Pb in Sn-Zn
alloys enhances the diffusion, resulting in severe degradation at 85°C/85%RH exposure. In contrast, the exposure at 60°C/90%RH
does not influence the joint strength for up to 1000 h. Under this condition, the oxidation of Zn only reaches a few microns
in depth from the free surface. |
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Keywords: | Sn-Zn low temperature oxidation heat/humidity test lead-free solders |
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