| AlN基板用厚膜浆料发展评述 |
| |
| 引用本文： | 罗庭碧,张晓民.AlN基板用厚膜浆料发展评述[J].电子元件与材料,2007,26(3):5-8. |
| |
| 作者姓名： | 罗庭碧 张晓民 |
| |
| 作者单位： | 昆明贵金属研究所,云南,昆明,650221;昆明贵金属研究所,云南,昆明,650221 |
| |
| 摘 要： | 介绍了AlN基片所用厚膜浆料的产品性能。从金属粉体的制备,粘结方式探索和烧结工艺的改进等方面综述了该领域的研究进展。目前粉体制备还是以化学还原为主。粘结方式中,玻璃相粘结具有较高的可靠性;反应粘结因导热性和热应力等方面的优势,使其成为AlN基板厚膜浆料粘结的重要方式。
|
| 关 键 词： | 电子技术 厚膜浆料 综述 AlN基板 金属粉体 粘结方式 烧结工艺 |
| 文章编号： | 1001-2028（2007）03-0005-04 |
| 修稿时间： | 2006-10-23 |
Review of development on thick film paste for AlN substrate |
| |
| LUO Ting-bi,ZHANG Xiao-min.Review of development on thick film paste for AlN substrate[J].Electronic Components & Materials,2007,26(3):5-8. |
| |
| Authors: | LUO Ting-bi ZHANG Xiao-min |
| |
| Affiliation: | Kunming Institute of Precious Metals, Kunming 650221, China |
| |
| Abstract: | The performance of thick film paste for AlN substrate was summarized, relating to manufacture of metallic powder, study of bonding manner and improvement on firing process. Currently, metallic powder was prepared mostly by chemical reduction. Although the reliability of the frit-bonding system is higher than others, the reaction-bonding system has advantages of higher thermal conduction and lower thermal stress. Reaction-bonding method will be an important method of bonding in thick film paste for AlN substrate. |
| |
| Keywords: | electron technology thick film paste review AlN substrate metallic powder bonding manner firing procedess |
| 本文献已被 CNKI 维普 万方数据 等数据库收录！ |
