| 某直升机机载设备印制板振动试验失效分析 |
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| 引用本文： | 薄玉奎.某直升机机载设备印制板振动试验失效分析[J].电子机械工程,2011,27(4):13-15,20. |
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| 作者姓名： | 薄玉奎 |
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| 作者单位： | 南京电子技术研究所,江苏南京,210039 |
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| 摘 要： | 文中以某机载电子设备振动试验中印制板（PCB）故障现象为研究对象,通过理论分析和ANSYS动力学计算的方法对PCB板产生故障的机理进行了分析和计算。计算结果与试验现象相符,认为谐振和PCB板设计问题是导致该试验故障的原因,并在结构接口方面对引起谐振的情况进行了分析,阐述了结构和电讯方面相应的改进措施。
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| 关 键 词： | 印制板 振动试验 失效分析 |
PCB Vibration Test Failure Analysis for Helicopter-borne Equipment |
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| BO Yu-kui.PCB Vibration Test Failure Analysis for Helicopter-borne Equipment[J].Electro-Mechanical Engineering,2011,27(4):13-15,20. |
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| Authors: | BO Yu-kui |
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| Affiliation: | BO Yu-kui(Nanjing Research Institute of Electronics Technology,Nanjing 210039,China) |
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| Abstract: | The mechanism which results in the PCB failure in a vibration test for the helicopter-borne electronic equipment is described in this paper by theoretical analysis and ANSYS dynamic calculation.The calculation results agree with the test phenomenon.Resonance and defects in PCB design are determined as the reasons of the PCB failure.The structural interface problem which results in the resonance is analyzed.And the structural and electronic improvement measures are introduced,too. |
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| Keywords: | printed circuit board(PCB) vibration test failure analysis |
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