Constitutive Relations for Creep in a SnCu-Based Composite Solder Reinforced with Ag Particles |
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| Authors: | Yaowu Shi Yanfu Yan Jianping Liu Zhidong Xia Yongping Lei Fu Guo Xiaoyan Li |
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| Affiliation: | (1) School of Materials Science and Engineering, Beijing University of Technology, 100 Ping Le Yuan, Chaoyang District, Beijing, 100022, China |
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| Abstract: | In the present work, the creep strain of the composite solder joint is measured using a stepped load creep test on a single specimen. Based on the creep strain tests, constitutive relations for the steady-state creep rate are determined for the Ag-particle-reinforced Sn-0.7Cu-based composite solder joint. In addition, creep strain tests on the Sn-0.7Cu solder joint are performed as a comparison. It is found that the activation energy of the Ag-particle-reinforced Sn-0.7Cu-based composite solder joint is higher than that of the Sn-0.7Cu solder joint. At the same time, the stress exponent of the Ag-particle-reinforced Sn-0.7Cu-based composite solder joint is higher than that of the Sn-0.7Cu solder joint. It is expected that the creep resistance of the Ag-particle-reinforced Sn-0.7Cu-based composite solder joint will be superior to that of the Sn-0.7Cu solder joint. Finally, the creep deformation mechanisms of the solder joint are discussed. |
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| Keywords: | Sn-0.7Cu lead-free composite solder creep constitutive relation |
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