面向便携化电子产品的封装技术

随着人们对便携式的和手持设备的市场需求不断增加,为了能够在具有较高功能的前提下,拥有小型化、轻型化和高性能的器件,使用裸管芯产品的多芯片封装的益处就非常明显。于是开发设计和组装技术面临着新的挑战,人们关注采用比传统的表面贴装器件更低的成本,来获取比芯片上系统解决方案更快的进入市场的时间。使这些先进的封装技术得以实现的因素是依赖芯籽产品。

The Packaging Technology to Face Portable Applications

With market requirements of portable and handheld equipment increasing, the advantage of the multi-chip packaging technology using die products became clear in order to process smaller, lighter and higher performing devices with greater functionality. Then develop designs and assembly technologies have take new challenge, and result in a lower cost than traditional surface mount devices, allowing faster time-to-market than the system on chip solutions. The enabling factor in these advanced packaging technologies is reliance on die products.