| 影响不流动半固化片粘结因素的探析 |
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| 引用本文： | 刘榕健,郑军,郑英东.影响不流动半固化片粘结因素的探析[J].印制电路信息,2013(3):18-22. |
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| 作者姓名： | 刘榕健 郑军 郑英东 |
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| 作者单位： | 广东生益科技股份有限公司,广东 东莞 523039 |
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| 摘 要： | 不流动PP的流动性很低，与常规FR-4有很大的区别，如采用常规的压合条件，PCB板件经常出现不流动PP粘合不良问题。结合实验验证，详细分析了影响不流动半固化片粘合的因素，为有效提高不流动半固化片粘结强度提供了若干建议。
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| 关 键 词： | 不流动 低流动 半固化片 粘结不良 |
The analysis of the factors of No-Flow prepreg adhesion |
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| Affiliation: | LIU Rong-jian ZHEN Jun ZHEN Ying-dong |
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| Abstract: | The liquidity of No-Flow prepreg is very low and very different with normal FR-4. For example, if we use the press program of normal FR-4 to press No-Flow prepreg, there will be problems of adhesive in PCB making. Combining with the experimental verification, this article analyzes the factors of No-Flow prepreg adhesion in detail, and gives several effective suggestions to improve No-Flow prepreg adhesive strength. |
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| Keywords: | No-Flow Low-flow Prepreg Bad Adhesion |
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