Effects of Pd concentration on the interfacial reaction and mechanical reliability of the Sn-Pd/Ni system

The liquid-solid reaction between Sn-xPd alloy and Ni (x = 0.05-1 wt.%) and the resulting mechanical reliability of the system were examined in this study. The reactions strongly depended on the Pd concentration and the reaction time. When the Pd concentration was low (i.e., x = 0.05 wt.%), the reaction product was only Ni₃Sn₄. In contrast, when the Pd concentration was high (i.e., x ≥ 0.2 wt.%), the reaction product became a dual-layer structure of (Pd,Ni)Sn₄-Ni₃Sn₄. Between 0.05 wt.% and 0.2 wt.% (e.g., x = 0.1 wt.%), discontinuous (Pd,Ni)Sn₄ grains scattered over the Ni₃Sn₄ layer developed. Interestingly, the (Pd,Ni)Sn₄ grains were gradually dispersed in the molten Sn-Pd alloy, leaving the Ni₃Sn₄ at the interface, as the reaction time increased. These Pd-dependent reactions were dictated by thermodynamics and can be rationalized using the Pd-Ni-Sn isotherm. Furthermore, the results of the high-speed-ball-shear (HSBS) test indicated that the mechanical strength of the Sn-Pd/Ni joints dramatically degraded by over one third due to the formation of (Pd,Ni)Sn₄ at the interface. The implication is that the Pd concentration in Sn-Pd solder joints should be reduced to a level below 0.2 wt.% to prevent the creation of an undesired microstructure.