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Multifunctional Materials Strategies for Enhanced Safety of Wireless,Skin-Interfaced Bioelectronic Devices |
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| Authors: | Claire Liu Jin-Tae Kim Da Som Yang Donghwi Cho Seonggwang Yoo Surabhi R. Madhvapathy Hyoyoung Jeong Tianyu Yang Haiwen Luan Raudel Avila Jihun Park Yunyun Wu Kennedy Bryant Min Cho JiYong Lee Jay Young Kwak WonHyoung Ryu Yonggang Huang Ralph G. Nuzzo John A. Rogers |
| Affiliation: | 1. Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, 60208 USA;2. Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, 60208 USA Advanced Materials Division, Korea Research Institute of Chemical Technology, Yuseong-gu, Daejeon, 34114 Republic of Korea;3. Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, 60208 USA Department of Materials Science and Engineering, Northwestern University, Evanston, IL, 60208 USA;4. Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, 60208 USA Department of Electrical and Computer Engineering, University of California Davis, Davis, CA, 95616 USA;5. Department of Mechanical Engineering, Northwestern University, Evanston, IL, 60208 USA;6. Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, 60208 USA Department of Chemical and Biomolecular Engineering, University of Illinois Urbana-Champaign, Urbana, IL, 61801 USA;7. School of Mechanical Engineering, Yonsei University, Seoul, 03722 Republic of Korea Department of Mechanical Engineering, University of Minnesota Twin Cities, Minneapolis, MN, 55455 USA;8. Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, 60208 USA Department of Mechanical Engineering, Northwestern University, Evanston, IL, 60208 USA;9. School of Mechanical Engineering, Yonsei University, Seoul, 03722 Republic of Korea;10. Department of Chemistry, University of Illinois Urbana-Champaign, Urbana, IL, 61801 USA |
| Abstract: | Many recently developed classes of wireless, skin-interfaced bioelectronic devices rely on conventional thermoset silicone elastomer materials, such as poly(dimethylsiloxane) (PDMS), as soft encapsulating structures around collections of electronic components, radio frequency antennas and, commonly, rechargeable batteries. In optimized layouts and device designs, these materials provide attractive features, most prominently in their gentle, noninvasive interfaces to the skin even at regions of high curvature and large natural deformations. Past studies, however, overlook opportunities for developing variants of these materials for multimodal means to enhance the safety of the devices against failure modes that range from mechanical damage to thermal runaway. This study presents a self-healing PDMS dynamic covalent matrix embedded with chemistries that provide thermochromism, mechanochromism, strain-adaptive stiffening, and thermal insulation, as a collection of attributes relevant to safety. Demonstrations of this materials system and associated encapsulation strategy involve a wireless, skin-interfaced device that captures mechanoacoustic signatures of health status. The concepts introduced here can apply immediately to many other related bioelectronic devices. |
| Keywords: | composite materials safety soft electronics stimuli-responsive wireless wearables |