| 硅微粉填料对环氧灌封材料性能的影响 |
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| 引用本文： | 刘运学,王晓丹,范兆荣,谷亚新,礼航,杨水林. 硅微粉填料对环氧灌封材料性能的影响[J]. 天津化工, 2009, 23(4): 30-32. DOI: 10.3969/j.issn.1008-1267.2009.04.010 |
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| 作者姓名： | 刘运学 王晓丹 范兆荣 谷亚新 礼航 杨水林 |
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| 作者单位： | 1. 东北大学材料与冶金学院,辽宁,沈阳,110004;沈阳建筑大学材料学院,辽宁,沈阳,110168
2. 沈阳建筑大学材料学院,辽宁,沈阳,110168 |
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| 摘 要： | 以液态双酚A环氧树脂为基料，苯酐为固化剂，味唑类为促进剂，苄基缩水甘油醚为稀释剂，硅微粉为填料制得了性能优异的电器灌封材料。考察了硅微粉的种类及用量对环氧灌封材料的凝胶化时间、冲击强度、吸水率、体积电阻率的影响。结果表明活性硅微粉对提高环氧灌封材料的性能有利，当活性硅微粉用量为150质量份时，环氧灌封材料的综合性能较佳。
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| 关 键 词： | 环氧灌封材料 硅微粉 性能 影响 |
The influence of filler on the properties of epoxy encapsulating materials |
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| LIU Yun-xue,WANG Xiao-dan,Fan Zhao-rong,GU Ya-xin,Li Hang,YANG Shui-lin. The influence of filler on the properties of epoxy encapsulating materials[J]. Tianjin Chemical Industry, 2009, 23(4): 30-32. DOI: 10.3969/j.issn.1008-1267.2009.04.010 |
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| Authors: | LIU Yun-xue WANG Xiao-dan Fan Zhao-rong GU Ya-xin Li Hang YANG Shui-lin |
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| Affiliation: | LIU Yun-xue, WANG Xiao-dan, Fan Zhao-rong, GU Ya-xin, Li Hang, YANG Shui-lin(1.School of Materials ＆ Metallurgy, Northeastern University, Shenyang 110004,China,＇2.School of Material Science and Engineering, She nyang Jian Zhu University, Shenyang 110168, China) |
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| Abstract: | Epoxy encapsulateing materials with high property were prepared using epoxy as matrix.PA as curing agent,imidazole as accelerant,benzyl glycidol ether as thinner,silica powder as the filler.The influence of the kind and using level of silica powder on the gelation time,impact strength,water absorption and volume resistivety of the epoxy encapsulateing materials were studied.The experimental results indicated that the active silica powder played an important role in materiall's property,the combination property is better when the using level of active silica powder is 150 mass number. |
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| Keywords: | epoxy encapsulateing materials silica powder property influence |
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