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| 基于聚合物介质的低温硅硅键合研究 | |
| 引用本文： | 管朋,;展明浩. 基于聚合物介质的低温硅硅键合研究[J]. 电子科技, 2014, 27(9): 175-177 |
| 作者姓名： | 管朋, 展明浩 |
| 作者单位： | (1.合肥工业大学 电子科学与应用物理学院,安徽 合肥 230009; 2.中国兵器集团214研究所 工艺1部,安徽 蚌埠 233042) |
| 摘 要： | 聚合物低温键合技术是MEMS器件圆片级封装的一项关键技术。以苯并环丁烯(BCB)、聚对二甲苯(Parylene)、聚酰亚胺(Polyimide)、有机玻璃(PMMA)作为键合介质,对键合的温度、压力、气氛、强度等工艺参数进行了研究,并分析了其优缺点。通过改变Parylene的旋涂、键合温度、键合压力、键合时间等工艺参数进行了优化实验。结果表明,在230 ℃的低温键合条件下封装后的MEMS器件具有良好的键合强度(＞3.600 MPa),可满足MEMS器件圆片级封装要求。 |
| 关 键 词： | 低温键合 聚合物 键合强度 圆片级封装 |
Study of Low-temperature Si/Si Bonding with Polymer Medium |
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| GUAN Peng,ZHAN Minghao. Study of Low-temperature Si/Si Bonding with Polymer Medium[J]. Electronic Science and Technology, 2014, 27(9): 175-177 | |
| Authors: | GUAN Peng ZHAN Minghao |
| Affiliation: | (1.School of Electronic Science & Applied Physics,Hefei University of Technology,Hefei 230009,China; 2.First Unit of Technology,Institute 214 of China North Industries Group,Bengbu 233042,China) |
| Abstract: | Low-temperature bonding using polymer medium is a key technique of the wafer-level adhesive bonding in MEMS devices. With BCB,Parylene,Polyimide,PMMA as the bonding medium,the bonding temperature,bonding force,atmosphere and bond strength are studied,and their advantages and disadvantages are analyzed. Parylene bonding parameters are optimized by changing spin coating,bonding temperature,bonding force,bonding times and etc. The results show that low temperature bonding encapsulation of MEMS devices has good bonding strength（ 3. 600 MPa） at 230 ℃,meeting the requirements of the wafer-level adhesive bonding in MEMS devices. |
| Keywords: | low-temperature bonding polymer bonding strength wafer-level packaging |
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