| Forced Convective Air Cooling from Electronic Component Arrays in a Parallel |
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| 作者姓名： | D.Y.Cai Y.P.Gan |
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| 作者单位： | D.Y. Cai (North China Institute Computing Technology)Y.P. Gan; C.F. Ma; Q.X. Li (Department of Thermal Energy Engineering，Beijing Polytechnic University，Beijing 100022，China) |
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| 摘 要： | ＦｏｒｃｅｄＣｏｎｖｅｃｔｉｖｅＡｉｒＣｏｏｌｉｎｇｆｒｏｍＥｌｅｃｔｒｏｎｉｃＣｏｍｐｏｎｅｎｔＡｒｒａｙｓｉｎａＰａｒａｌｌｅｌＰｌａｔｅＣｈａｎｎｅｌ．Ｙ．Ｃａｉ（ＮｏｒｔｈＣｈｉｎａＩｎｓｔｉｔｕｔｅＣｏｍｐｕｔｉｎｇＴｅｃｈｎｏｌｏｇｙ）Ｙ...
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| 关 键 词： | 强制对流 热传导 电子器件阵列 空气冷却 |
Forced convective air cooling from electronic component arrays in a parallel plate channel |
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| D. Y. Cai,Y. P. Gan,C. F. Ma,Q. X. Li.Forced Convective Air Cooling from Electronic Component Arrays in a Parallel[J].Journal of Thermal Science,1994,3(3):161-166. |
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| Authors: | D Y Cai Y P Gan C F Ma Q X Li |
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| Affiliation: | (1) North China Institute Computing Technology, China;(2) Department of Thermal Energy Engineering, Beijing Polytechnic University, 100022 Beijing, China |
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| Abstract: | This paper discusses air forced convection heat transfer from inline protruding elements arranged in eight rows. The streamwise and spanwise spacings between elements were varied using a splitter plate that can be positioned at three different modular configurations. A set of empirical formulas waspresented to correlate the experimental data for the design of air cooling systems. Arrays of components with one odd-size module have been tested also. Experimental results show that blocks near the entrance and behind the odd-size module have improved performance compared with uniform arrangements. Accordingly, temperature sensitive components are suggested to be arranged in these locations. |
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| Keywords: | convection heat transfer air cooling |
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