Study on forced air convection cooling for electronic assemblies |
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Authors: | Bin Li Wenquan Tao and Yaling He |
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Affiliation: | (1) School of Energy & Power Engineering, Xi’an Jiaotong University, Xi’an, 710049, China |
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Abstract: | The slotted fin concept was employed to improve the air cooling performance of plate-fin in heat sinks. Numerical simulations
of laminar heat transfer and flow pressure drop were conducted for the integral plate fin, discrete plate fin and discrete
slotted fin heat sinks. It is found that the performance of the discrete plate fin is better than that of the integral continuum
plate fin and the performance of slotted fin is better than that of the discrete plate fin at the same pumping power of the
fan. A new type of heat sink characterized by discrete and slotted fin surfaces with thinner fins and smaller spaces between
fins is then proposed. Preliminary computation shows that this type of heat sink may be useful for the next generation of
higher thermal load CPUs. The limit of cooling capacity for air-cooling techniques was also addressed.
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Translated from Journal of Xi’an Jiaotong University, 2006, 40(11): 1241–1245 译自: 西安交通大学学报] |
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Keywords: | electronic assemblies heat sink slotted fin discrete fin |
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