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同步辐射x射线光刻制作深亚微米T形栅
引用本文:谢常青,陈大鹏,李兵,叶甜春. 同步辐射x射线光刻制作深亚微米T形栅[J]. 微纳电子技术, 2002, 39(6): 39-41
作者姓名:谢常青  陈大鹏  李兵  叶甜春
作者单位:中国科学院微电子中心,北京,100010
摘    要:x射线光刻非常适合用于深亚微米T形栅的制作,这是因为它的高分辨率、大的曝光视场和高的生产效率足以满足MMIC制造工艺的要求。本文中我们首先对我们的x射线掩模制造工艺进行介绍,然后论述了一种用于制造深亚微米T形栅的两层胶工艺,介绍了所取得的一些研究结果,最后对国内的深亚微米光刻现状进行了简要分析。

关 键 词:T形栅  x射线掩模  x射线光刻  同步辐射
文章编号:1671-4776(2002)06-0039-03
修稿时间:2002-01-25

Deep-submicron T-shaped gate fabrication technology using synchrotron radiation x-ray lithography
XIE Chang-qing,CHEN Da-peng,LI Bing,YE Tian-chun. Deep-submicron T-shaped gate fabrication technology using synchrotron radiation x-ray lithography[J]. Micronanoelectronic Technology, 2002, 39(6): 39-41
Authors:XIE Chang-qing  CHEN Da-peng  LI Bing  YE Tian-chun
Abstract:X-ray lithography is very suited for the fabrication of deep-submicron T-shaped gate,because its combination of high resolution,large exposure window and high throughout satisfies the requirements for MMIC manufacturing process.In this paper,the home-made x-ray mask fabri-cation process is introduced firstly,then a two layer resists method which is used to fabricate deep-submicron T-shaped gate and some initial research results are described,and the domestic deep-submicron lithography status is analyzed briefly at last.
Keywords:T-shaped gate  x-ray mask  x-ray lithography  synchrotron radiation
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