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Active soldering of ZnS–SiO2 sputtering targets to copper backing plates using an Sn3.5Ag4Ti(Ce, Ga) filler metal |
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| Authors: | S.Y. Chang T.H. Chuang L.C. Tsao C.L. Yang Z.S. Yang |
| Affiliation: | aDepartment of Mechanical Engineering, National Yunlin University of Science & Technology, 640 Touliu, Taiwan bDepartment of Materials Science and Engineering, National Taiwan University, 106 Taipei, Taiwan |
| Abstract: | An Sn3.5Ag4Ti(Ce, Ga) active solder is used for joining ZnS–SiO2 ceramic sputtering targets with copper backing plates at 250 °C in air. Direct soldering using the Sn3.5Ag4Ti(Ce, Ga) metal filler has been found to be a reliable and simple technique for ZnS–SiO2 ceramic bonding with ZnS–SiO2 and copper. The shear strengths for ZnS–SiO2/ZnS–SiO2 and ZnS–SiO2/Cu joints are 6.5 and 5.2 MPa, respectively. The bonding mechanism is described, with emphasis placed on the action of a rare earth element (Ce) and the active metal reaction. The interfacial reaction between Sn3.5Ag4Ti(Ce, Ga) filler metal and copper at temperatures ranging from 120 to 200 °C is conducted and discussed. |
| Keywords: | Active soldering ZnS–SiO2 Copper Sn3.5Ag4Ti(Ce Ga) |
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