Optimization of black oxide coating thickness as an adhesion promoter for copper substrate in plastic integrated-circuit packages |
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Authors: | Mohamed Lebbai Jang-Kyo Kim W K Szeto Matthew M F Yuen Pin Tong |
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Affiliation: | (1) Department of Mechanical Engineering, Hong Kong University of Science and Technology, Clear Water Bay, Kowloon, Hong Kong;(2) QPL Ltd., QPL Industrial Bldg. Tsuen Wan, NT, Hong Kong |
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Abstract: | Copper-oxide coating applied onto the copper substrate has emerged as an alternative to metallic coatings to improve adhesion
with polymeric adhesives and molding compounds. The interfacial-bond strengths between the black oxide-coated Cu substrate
and epoxy-based, glob-top resin were measured in button-shear tests, and the failure mechanisms were identified from the fracture-surface
examination. The emphasis was to establish the correlation between the coating thickness, the surface roughness, and the interfacial
adhesion with respect to treatment time. It was found that at the initial stage of treatment a thin layer of flat, cuprous
oxide developed, above which fibrillar-cupric oxide was formed with further treatment until saturation with densified fibrils
at about 150 sec. The interfacial-bond strength between the oxide-coated copper substrate and glob-top resin increased gradually
with increasing treatment time, until the bond strength reached a plateau constant after a treatment for about 150 sec. There
was a functional similarity between the oxide thickness, the surface roughness, and the interface-bond strength with respect
to treatment time. A treatment time of 150 sec is considered an optimal condition that can impart the highest interface adhesion. |
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Keywords: | Interfacial adhesion copper substrate black oxide coating thickness surface roughness |
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