| 电镀可焊性Sn-3.0 Ag合金镀层影响因素的研究 |
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| 引用本文： | 于海燕,王兵.电镀可焊性Sn-3.0 Ag合金镀层影响因素的研究[J].沈阳工业大学学报,2002,24(6):534-537. |
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| 作者姓名： | 于海燕 王兵 |
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| 作者单位： | 沈阳工业大学,理学院,辽宁,沈阳,110023 |
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| 摘 要： | 研究了甲基磺酸盐体系电镀Sn-3.0Ag合金时，镀液成分和镀覆条件对锡银合金镀层中银含量以及阴极极化的影响，结果表明，镀层中银含量随镀液中银含量的增加，镀液PH值的降低，光亮剂浓度的增加和阴极电流密度的降低而增加，柠檬酸钠和2，3，4－三甲氧基苯甲醛对单金属锡，碘化钾和丁二酮肟对单金属银阴极化较大。
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| 关 键 词： | 电镀 可焊性镀层 Sn－3.0Ag合金 可焊性镀层 锡银合金 镀液成分 镀覆条件 |
| 文章编号： | 1000-1646(2002)06-0534-04 |
| 修稿时间： | 2002年7月24日 |
Study on electroplating processes of solderable coatings from Methanesulfonate Bath |
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| YU Hai yan,WANG Bing.Study on electroplating processes of solderable coatings from Methanesulfonate Bath[J].Journal of Shenyang University of Technology,2002,24(6):534-537. |
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| Authors: | YU Hai yan WANG Bing |
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| Abstract: | Electroplating bath for a new solderable coating SnAg (Ag 3? % )alloy with low Ag composition was studied. Methanesulfonate of tin and silver were determined as main salts. Sodium citrate, potassium iodide and triethanolamine were used as chelating agents. Effects of every composition in bath and plating condition on coating qualities were researched. It has been found, by examinations on solderability and antioxygenation ability at high tmperature, that tin silver alloy coating has advantage over tin lead alloy coating, and fitted for industry, because of its stableness and non poisonous character. |
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| Keywords: | electroplating Sn Ag alloy solderability |
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