Spontaneous, non-aqueous electrochemical deposition of copper and palladium on Al and Al(Cu) thin films |
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Authors: | R Fang H Gu M J O'Keefe T J O'Keefe W S Shih K D Leedy R Cortez |
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Affiliation: | (1) Dept. of Metallurgical Engineering, and Materials Research Center, University of Missouri-Rolla, 65 409 Rolla, MO;(2) Brewer Science, Inc., 65401 Rolla, MO;(3) Sensors Directorate, WPAFB, Air Force Research Laboratory, 45433, OH |
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Abstract: | Copper and palladium seed layers have been successfully deposited from organic solutions onto patterned and unpatterned pure
aluminum and Al(0.5%Cu) thin films using an immersion displacement process. The reaction occurs at ambient temperature and
pressure by a spontaneous electrochemical mechanism. Copper and palladium deposition using the organic solution was studied
as a function of reaction time and Cu or Pd concentration in the solution. It was found that both time and the intial ionic
metal concentration significantly influence deposit morphology, particle size and shape, and adherence. Nucleation of Cu or
Pd sub-micron particles on both Al and Al(Cu) surfaces occurred in less than one minute while nucleation density and particle
size increased with longer deposition times. Increasing the copper or palladium concentration in the organic solution resulted
in an increase in the final particle size of the seed crystals. However, an increase in deposition time and metal concentration
in the organic solution caused more extensive dissolution and pitting of the aluminum thin films. The Cu and Pd deposits were
effectively used as catalytic sites for subsequent electroless or electrolytic copper deposition using conventional aqueous
processes. |
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Keywords: | Copper palladium non-aqueous selective electrochemical deposition solder |
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