首页 | 本学科首页   官方微博 | 高级检索  
     


Spontaneous, non-aqueous electrochemical deposition of copper and palladium on Al and Al(Cu) thin films
Authors:R Fang  H Gu  M J O'Keefe  T J O'Keefe  W S Shih  K D Leedy  R Cortez
Affiliation:(1) Dept. of Metallurgical Engineering, and Materials Research Center, University of Missouri-Rolla, 65 409 Rolla, MO;(2) Brewer Science, Inc., 65401 Rolla, MO;(3) Sensors Directorate, WPAFB, Air Force Research Laboratory, 45433, OH
Abstract:Copper and palladium seed layers have been successfully deposited from organic solutions onto patterned and unpatterned pure aluminum and Al(0.5%Cu) thin films using an immersion displacement process. The reaction occurs at ambient temperature and pressure by a spontaneous electrochemical mechanism. Copper and palladium deposition using the organic solution was studied as a function of reaction time and Cu or Pd concentration in the solution. It was found that both time and the intial ionic metal concentration significantly influence deposit morphology, particle size and shape, and adherence. Nucleation of Cu or Pd sub-micron particles on both Al and Al(Cu) surfaces occurred in less than one minute while nucleation density and particle size increased with longer deposition times. Increasing the copper or palladium concentration in the organic solution resulted in an increase in the final particle size of the seed crystals. However, an increase in deposition time and metal concentration in the organic solution caused more extensive dissolution and pitting of the aluminum thin films. The Cu and Pd deposits were effectively used as catalytic sites for subsequent electroless or electrolytic copper deposition using conventional aqueous processes.
Keywords:Copper  palladium  non-aqueous  selective  electrochemical deposition  solder
本文献已被 SpringerLink 等数据库收录!
设为首页 | 免责声明 | 关于勤云 | 加入收藏

Copyright©北京勤云科技发展有限公司  京ICP备09084417号