刚挠结合印制板的加工工艺研究

随着电子技术的发展,尤其是电子组装技术的不断进步,很多场合下一般的刚性印制板已经很难满足电子产品“轻、薄、短、小”的要求。因此,刚挠结合印制板(挠性基材和刚性基材结合的印制板)的应用由于其显著的优越性有着越来越广泛的前景。本文主要介绍刚挠结合印制板的加工工艺,指出了加工过程的技术难点,并提出了解决办法。

Flexible-Rigid Board's Processing Technology Research

With the development of elctronic technology,especially progress of assembly technique ,it is now difficult for rigid PCB to meet the demand of 'lighter, thinner, shorter and smaller' of elctronic products.So the application of flexible-rigid PCB,which includes flexible laminated layers and rigid ,has better and better foreground with its visible advantage.This paper mainly introduces the processing technology, points out the processing difficulties,and brings forward the corresponding resoluents.