| 带有热沉结构的全镂空光读出红外焦平面阵列 |
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| 引用本文： | 刘瑞文,孔延梅,焦斌斌,李志刚,尚海平,卢狄克,高超群,陈大鹏,张青川. 带有热沉结构的全镂空光读出红外焦平面阵列[J]. 半导体学报, 2013, 34(2): 024005-6 |
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| 作者姓名： | 刘瑞文 孔延梅 焦斌斌 李志刚 尚海平 卢狄克 高超群 陈大鹏 张青川 |
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| 作者单位： | Integrated Circuit Advanced Process Center,Key Laboratory of Microelectronics Device and Integration Technology,Institute of Microelectronics,Chinese Academy of Sciences;Kunshan MicroOptica Electronic Co.Ltd;University of Science and Technology of China |
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| 基金项目： | Project supported by the Chinese Academy of Sciences Knowledge Innovation Project(No.07YF031001);the Natural Science Foundation of Jiangsu Province,China(No.BK2012219),the Key Lab of Microelectronics Device and Integration Technology,China |
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| 摘 要： | A substrate-free optical readout focal plane array(FPA) operating in 8-12μm with a heat sink structure (HSS) was fabricated and its performance was tested.The temperature distribution of the FPA with an HSS investigated by using a commercial FLIR IR camera shows excellent uniformity.The thermal cross-talk effect existing in traditional substrate-free FPAs was eliminated effectively.The heat sink is fabricated successfully by electroplating copper,which provides high thermal capacity and high thermal conductivity,on the frame of substrate-free FPA. The FPA was tested in the optical-readout system,the results show that the response and NETD are 13.6 grey/K(F / # = 0.8) and 588 mK,respectively.
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| 关 键 词： | infrared focal plane array substrate-free optical readout heat sink structure |
A substrate-free optical readout focal plane array with a heat sink structure |
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| Liu Ruiwen,Kong Yanmei,Jiao Binbin,Li Zhigang,Shang Haiping,Lu Dike,Gao Chaoqun,Chen Dapeng and Zhang Qingchuan. A substrate-free optical readout focal plane array with a heat sink structure[J]. Chinese Journal of Semiconductors, 2013, 34(2): 024005-6 |
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| Authors: | Liu Ruiwen Kong Yanmei Jiao Binbin Li Zhigang Shang Haiping Lu Dike Gao Chaoqun Chen Dapeng Zhang Qingchuan |
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| Affiliation: | Integrated Circuit Advanced Process Center, Key Laboratory of Microelectronics Device and Integration Technology, Institute of Microelectronics, Chinese Academy of Sciences, Beijing 100029, China;Kunshan MicroOptica Electronic Co. Ltd, Kunshan 215300, China;Integrated Circuit Advanced Process Center, Key Laboratory of Microelectronics Device and Integration Technology, Institute of Microelectronics, Chinese Academy of Sciences, Beijing 100029, China;Kunshan MicroOptica Electronic Co. Ltd, Kunshan 215300, China;Integrated Circuit Advanced Process Center, Key Laboratory of Microelectronics Device and Integration Technology, Institute of Microelectronics, Chinese Academy of Sciences, Beijing 100029, China;Kunshan MicroOptica Electronic Co. Ltd, Kunshan 215300, China;Integrated Circuit Advanced Process Center, Key Laboratory of Microelectronics Device and Integration Technology, Institute of Microelectronics, Chinese Academy of Sciences, Beijing 100029, China;Kunshan MicroOptica Electronic Co. Ltd, Kunshan 215300, China;Integrated Circuit Advanced Process Center, Key Laboratory of Microelectronics Device and Integration Technology, Institute of Microelectronics, Chinese Academy of Sciences, Beijing 100029, China;Kunshan MicroOptica Electronic Co. Ltd, Kunshan 215300, China;Integrated Circuit Advanced Process Center, Key Laboratory of Microelectronics Device and Integration Technology, Institute of Microelectronics, Chinese Academy of Sciences, Beijing 100029, China;Kunshan MicroOptica Electronic Co. Ltd, Kunshan 215300, China;Integrated Circuit Advanced Process Center, Key Laboratory of Microelectronics Device and Integration Technology, Institute of Microelectronics, Chinese Academy of Sciences, Beijing 100029, China;Kunshan MicroOptica Electronic Co. Ltd, Kunshan 215300, China;Integrated Circuit Advanced Process Center, Key Laboratory of Microelectronics Device and Integration Technology, Institute of Microelectronics, Chinese Academy of Sciences, Beijing 100029, China;Kunshan MicroOptica Electronic Co. Ltd, Kunshan 215300, China;Kunshan MicroOptica Electronic Co. Ltd, Kunshan 215300, China;University of Science and Technology of China, Hefei 230027, China |
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| Abstract: | |
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| Keywords: | infrared focal plane array substrate-free optical readout heat sink structure |
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