PTFE高频混压板问题解析

随着电子、通信产业的飞速发展,高频、RF设计越来越广泛,PCB上越来越多的运用到高频板材来满足信号传输的要求。但是由于高频板材价格较为昂贵,客户从节约成本的角度考虑,在PCB的结构设计上采用混压的方式,即除了必要的信号层采用HydroCarbon/Ceramic(或PTFE/Ceramic)结构的高频覆铜板材,以满足其信号传输速度、信号完整性以及阻抗匹配等要求,其他层采用常规FR-4覆铜板材。显然这样的设计对成本控制有很大的优势,但给PCB加工带来了一些其它问题。本文通过理论和实验对PTFE+FR-4混压板关键的工艺问题进行探讨,以期找到简单可行的解决方案与同行共勉。

PTFE high frequency board problem analysis

With electronics,the rapid development of communication industry,high-frequency,RF design more and more widely,PCB use more and more to the H/F Multilayer to meet the high-frequency signal transmission requirements.However,due to more expensive high-frequency boards,customers from a cost point of view,the structure of the PCB design using mixed compression methods,namely,in addition to the necessary signal layer HydroCarbon/Ceramic(or PTFE/Ceramic) structure of the high-frequency follow-copper plates,in ord...