| 直接法键合工艺制造PN结 |
| |
| 引用本文： | 孙甬,吴隆刚. 直接法键合工艺制造PN结[J]. 沈阳工业大学学报, 1989, 11(4): 91-96 |
| |
| 作者姓名： | 孙甬 吴隆刚 |
| |
| 作者单位： | 沈阳工业大学电子工程系(孙甬)，沈阳化工厂(吴隆刚) |
| |
| 摘 要： | 本文主要给出了不用任何媒介,直接将两个硅片结合在一起,形成pn结的方法及该pn结的特性。并从理论上对实验结果进行了论述。文章中还介绍了直接法键合工艺在半导体器件生产中的应用。
|
| 关 键 词： | 直接法 键合工艺 pn结 亲水性 处理 |
Bonding PN Junction by Means of Direct Method |
| |
| Sun Yong,Wu Longgang. Bonding PN Junction by Means of Direct Method[J]. Journal of Shenyang University of Technology, 1989, 11(4): 91-96 |
| |
| Authors: | Sun Yong Wu Longgang |
| |
| Abstract: | This paper presented a method of forming pn Junction which is made by means of two silicon surfaces contacted directly without using any media. The testing results and characteristic analysis are given and discussed theoretically Also the application in semiconductor device production is described. |
| |
| Keywords: | direct method bonding technology p-n junction hydrophific disposal |
| 本文献已被 CNKI 维普 等数据库收录！ |
