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Yttrium silicide formation and its contact properties on Si(1 0 0)
Authors:Wei Huang  Guo-Ping Ru  C Detavernier  Yu-Long Jiang  Bing-Zong Li
Affiliation:a Department of Microelectronics, Fudan University, Shanghai 200433, China
b Department of Solid State Sciences, Ghent University, Krijgslaan 281/S1, B-9000 Ghent, Belgium
Abstract:Yttrium silicide formation and its contact properties on Si(1 0 0) have been studied in this paper. By evaporating a yttrium metal layer onto Si(1 0 0) wafer in conventional vacuum condition and rapid thermal annealing, we found that YSi2-x begins to form at 350 °C, and is stable to 950 °C. Atomic force microscopy characterization shows the pinholes formation in the formed YSi2-x film. By current-voltage measurement, the Schottky barrier height (SBH) of YSi2-x diode on p-type Si(1 0 0) was shown to be between 0.63 and 0.69 eV for annealing temperature from 500 to 900 °C. By low temperature current-voltage measurement, the SBH of YSi2-x diode on n-type Si(1 0 0) was directly measured and shown to be 0.46, 0.37, 0.32 eV for annealing temperature of 500, 600, and 900 °C, respectively, and possibly even lower for annealing at 700 or 800 °C.
Keywords:Yttrium silicide  Schottky barrier  I-V-T  RTA
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