| 80Au-20Sn钎料焊点可靠性研究现状与展望 |
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| 引用本文： | 张国尚,荆洪阳,徐连勇,韩永典.80Au-20Sn钎料焊点可靠性研究现状与展望[J].机械工程材料,2009(11). |
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| 作者姓名： | 张国尚 荆洪阳 徐连勇 韩永典 |
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| 作者单位： | 天津大学材料科学与工程学院; |
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| 基金项目： | 国家自然科学基金资助项目(50575160); 教育部高等学校博士点基金资助项目(20050056035) |
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| 摘 要： | 共晶80Au-20Sn钎料在大功率电子及光电子器件封装中作为密封和芯片焊接材料特别具有吸引力,在这些应用中焊点的可靠性对于满足设备长期稳定运行至关重要。简要回顾了钎料焊点可靠性提出的背景,介绍了焊点可靠性的评价方法及当前不同工艺对80Au-20Sn钎料焊点的影响;指出今后其可靠性研究重点主要集中在复杂服役条件下焊接工艺优化、焊点可靠性测试方法、焊点寿命预测模型以及焊点本构模型等方面。
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| 关 键 词： | 80Au-20Sn钎料 焊点 可靠性 测试方法 |
Research Status and Prospect for 80Au-20Sn Solder Joint Reliability |
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| ZHANG Guo-shang,JING Hong-yang,XU Lian-yong,HAN Yong-dian.Research Status and Prospect for 80Au-20Sn Solder Joint Reliability[J].Materials For Mechanical Engineering,2009(11). |
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| Authors: | ZHANG Guo-shang JING Hong-yang XU Lian-yong HAN Yong-dian |
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| Affiliation: | ZHANG Guo-shang,JING Hong-yang,XU Lian-yong,HAN Yong-dian(School of Material Science & Engineering,Tianjin University,Tianjin 300072,China) |
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| Abstract: | Eutectic 80Au-20Sn solder alloy is particularly attractive for high-power electronics and optoelectronics packaging as the hermetic sealing and die attachment material.The reliability of solder joint is essential to meet the global demand for long operating lifetime in their applications.The research background of 80Au-20Sn solder joint is briefly reviewed first,and then the reliability assesment methods and the effects of different crafts are introduced.It is pointed that the focus of the study would be th... |
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| Keywords: | 80Au-20Sn solder solder joint reliability testing method |
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