| 锗元素对Sn-3.5Ag合金/铜界面反应的影响 |
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| 引用本文： | 李仕明,余春,陆皓. 锗元素对Sn-3.5Ag合金/铜界面反应的影响[J]. 机械工程材料, 2009, 0(9) |
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| 作者姓名： | 李仕明 余春 陆皓 |
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| 作者单位： | 上海交通大学材料科学与工程学院,上海,200240;上海交通大学材料科学与工程学院,上海,200240;上海交通大学材料科学与工程学院,上海,200240 |
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| 摘 要： | 通过向Sn-3.5Ag共晶合金中添加质量分数为0.1%,0.3%的锗元素,研究了锗元素对Sn-3.5Ag合金/铜界面反应的影响。结果表明:对于Sn-3.5Ag合金/铜界面,没加入锗元素时界面反应初生相为扇贝状Cu6Sn5,在热老化过程中此化合物层不断长大,且在Cu6Sn5/铜界面处生成新的Cu3Sn化合物,同时在Cu3Sn/铜界面上出现柯肯达尔空洞;当钎料中添加锗后,界面初生相也为Cu6Sn5化合物,在热老化阶段,Cu6Sn5化合物层厚度增长非常缓慢,且无Cu3Sn化合物生成,整个老化过程中都无柯肯达尔空洞出现。
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| 关 键 词： | 无铅钎焊 金属间化合物 界面反应 柯肯迭尔效应 |
Effect of Ge on Interfacial Reaction Sn-3.5Ag Alloy/Cu Interface |
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| LI Shi-ming,YU Chun,LU Hao. Effect of Ge on Interfacial Reaction Sn-3.5Ag Alloy/Cu Interface[J]. Materials For Mechanical Engineering, 2009, 0(9) |
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| Authors: | LI Shi-ming YU Chun LU Hao |
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| Affiliation: | LI Shi-ming,YU Chun,LU Hao(School of Materials Scionce and Engineering,Shanghai Jiaotong University,Shanghai 200240,China) |
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| Abstract: | Effect of Ge on the interfacial reaction of Sn-3.5Ag alloy(SA)/Cu interface was investigated through adding a small amount of Ge(0.1wt%,0.3wt%) into Sn-3.5 Ag emtectic alloy.The results show that the initial phase at the SA/Cu interface without Ge addition was scallop like Cu6Sn5.A new layer,which was determined as Cu3Sn,was formed at Cu6Sn5/Cu interface and grew continously after isothermal aging,and Kirkendall voids were found at Cu3Sn/Cu interface.For SA-xGe/Cu interface,the initial phase was still Cu6Sn... |
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| Keywords: | lead-free solder intermetallic compound interfacial reaction Kirkendall effect |
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