| 低介电常数聚合物材料的研究进展 |
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| 引用本文： | 袭锴,徐丹,贾叙东. 低介电常数聚合物材料的研究进展[J]. 高分子材料科学与工程, 2004, 20(4): 1-5 |
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| 作者姓名： | 袭锴 徐丹 贾叙东 |
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| 作者单位： | 南京大学高分子科学与工程系,江苏,南京,210093;南京大学高分子科学与工程系,江苏,南京,210093;南京大学高分子科学与工程系,江苏,南京,210093 |
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| 摘 要： | 综述了低介电常数(low-k)材料研究的基本情况，以及可用于微电子领域的低介电常数聚合物材料，包括材料的化学结构和基本物理性质。并着重介绍了带有纳米孔的超低介电常数材料的研究进展。同时，对低介电常数材料的制备工艺也进行了简要的总结。
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| 关 键 词： | 低介电常数 聚合物 纳米孔 聚硅氧烷 |
| 文章编号： | 1000-7555(2004)04-0001-05 |
| 修稿时间： | 2003-05-03 |
DEVELOPMENT OF LOW DIELECTRIC CONSTANT POLYMER MATERIALS |
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| XI Kai,XU Dan,JIA Xu-dong. DEVELOPMENT OF LOW DIELECTRIC CONSTANT POLYMER MATERIALS[J]. Polymer Materials Science & Engineering, 2004, 20(4): 1-5 |
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| Authors: | XI Kai XU Dan JIA Xu-dong |
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| Abstract: | The progress of a large variety of materials with low dielectric constants for applications in microelectrics was reviewed. The chemical structures, selected properties, and applications of low-k materials were also summarized. The materials with ultra low-k were emphatically introduced. Preparation methods of the materials were briefly introduced. The future development of dielectric materials is tightly connected to film and chip making process. |
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| Keywords: | low-k polymer nanoporous polysiloxane |
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