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PTCR陶瓷化学沉积镍电极的工艺及结构
引用本文:张道礼,东振中,龚树萍,周东祥.PTCR陶瓷化学沉积镍电极的工艺及结构[J].电子元件与材料,1999,18(3):22-23,32.
作者姓名:张道礼  东振中  龚树萍  周东祥
作者单位:华中理工大学电子科学与技术系,武昌,430074
基金项目:新材料领域项目;715-006-0070;
摘    要:用化学沉积法在PTCR陶瓷上制作镍电极可形成良好的欧姆接触,且成本较低。通过实验,优选出了合适的镀液成分、浓度及施镀条件。用扫描电镜分析了镍层的结构和成分,探讨了镀层的生长机理,并描述了核生长机理的模型。

关 键 词:化学沉积  镍电极  PTCR陶瓷  微观结构  生长机理

The Process of Nickel Eletroless Plating on PTCR Ceramics and the Microstructure of the Deposited Nickel
Zhang Daoli,Dong Zhenzhong,Gong Shuping,Zhou Dongxiang.The Process of Nickel Eletroless Plating on PTCR Ceramics and the Microstructure of the Deposited Nickel[J].Electronic Components & Materials,1999,18(3):22-23,32.
Authors:Zhang Daoli  Dong Zhenzhong  Gong Shuping  Zhou Dongxiang
Abstract:By chemical deposition process,nickel electrode on PTCR ceramics of ohmic contact can be acquired at low cost.Optimiaed composition and concentration of plating solution,plating conditions are obtained through experiment. The compositions and structure of nickel plating are analyzed through SEM.The growth mechanism of deposited nickel is investigated and nucleus growth model presented.(4 refs )
Keywords:electroless    deposition  nickel electrode  PTCR ceramics    Microstructure  growth mechanism  
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