| 反应烧结碳化硅材料的抗热震性能研究 |
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| 引用本文： | 朱丽慧,黄清伟. 反应烧结碳化硅材料的抗热震性能研究[J]. 耐火材料, 2001, 35(4): 202-204 |
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| 作者姓名： | 朱丽慧 黄清伟 |
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| 作者单位： | 1. 上海大学材料学院,
2. 中国科学院上海硅酸盐研究所 |
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| 基金项目： | 上海市教委青年科学基金资助项目。 |
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| 摘 要： | 通过对比不同温差热震后材料的残余强度 ,对反应烧结碳化硅材料的抗热震性能进行了研究。结果表明 :反应烧结碳化硅材料的抗热震性能与显微组织密切相关 ,低游离硅含量与小粒径的反应烧结碳化硅材料具有较好的抗热震断裂性能 ,而高游离硅含量或大碳化硅粒径的材料具有相对优异的抗热震损伤性。对反应烧结碳化硅材料的抗热震性与显微组织的关系进行了探讨。
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| 关 键 词： | 反应烧结 碳化硅 抗热震性 |
| 修稿时间： | 2000-10-10 |
Thermal shock resistance of reaction bonded silicon carbide materials |
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| Zhu Lihui,Huang QingweiSchool of Material Science and Engineering,Shanghai University,Shanghai ,China. Thermal shock resistance of reaction bonded silicon carbide materials[J]. Refractories, 2001, 35(4): 202-204 |
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| Authors: | Zhu Lihui Huang QingweiSchool of Material Science Engineering Shanghai University Shanghai China |
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| Affiliation: | Zhu Lihui,Huang QingweiSchool of Material Science and Engineering,Shanghai University,Shanghai 200050,China |
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| Abstract: | Thermal shock behaviors of reaction bonded silicon carbide(RBSC) materials were investigated by comparing the residual strength of the materials thermal shocked at different temperatures.Experimental results show that the thermal shock behaviors of the RBSC materials have relation to their microstructure.The RBSC material with fine SiC particles and low volume percent of Si is characterized by high thermal fracture resistance,while the materials with coarse SiC particle or high volume percent of Si are characterized by high thermal damage resistance.The relationship between the thermal shock resistance and microstructure of RBSC material is discussed. |
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| Keywords: | Reaction bonded SiC Thermal shock resistance |
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