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The Effects of Molecular Weight on the Single Lap Shear Creep and Constant Strain Rate Behavior of Thermoplastic Polyimidesulfone Adhesive |
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| Authors: | E Sancaktar S K Dembosky |
| Affiliation: | a Clarkson University, Department of Mechanical and Industrial Engineering, Potsdam, New York, U.S.A. b Kendall Visiting Scholar, The Kendall Company, Lexington Laboratory, Lexington, MA, U.S.A. |
| Abstract: | The bonded shear creep and constant strain rate behavior of zero, one, and three percent end capped Thermoplastic Polyimidesulfone adhesive were examined at room and elevated temperatures. End capping was accomplished by the addition of phthalic anhydrides.
The viscoelastic Chase-Goldsmith and elastic nonlinear relations gave a good fit to the experimental stress strain behavior. Ultimate stress levels and the safe levels for creep stresses were found to decrease as molecular weight was reduced. The primary objective was to determine the effects of molecular weight on the mechanical properties of the adhesive in the bonded form. Viscoelastic and nonlinear elastic constitutive equations were utilized to model the adhesive. Crochet's relation was used to describe the experimental creep failure data. The effects of molecular weight changes on the above mentioned mechanical behavior were assessed. |
| Keywords: | Chase-Goldsmith model mechanical properties molecular weight polyimidesulfone adhesive single lap shear creep strain rate behavior |
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