| 影响Ni/Cu电极Y5V MLCC耐焊接热失效的原因 |
| |
| 引用本文： | 齐坤,赖永雄,李基森. 影响Ni/Cu电极Y5V MLCC耐焊接热失效的原因[J]. 电子元件与材料, 2005, 24(8): 60-62 |
| |
| 作者姓名： | 齐坤 赖永雄 李基森 |
| |
| 作者单位： | 广东风华高新科技股份有限公司,广东,肇庆,526020;广东风华高新科技股份有限公司,广东,肇庆,526020;广东风华高新科技股份有限公司,广东,肇庆,526020 |
| |
| 基金项目： | 国家高技术研究发展计划(863计划) |
| |
| 摘 要： | 研究了铜电极端浆以及不同的烧端工艺对MLCC耐焊接热的影响。结果表明:选择粒径小且均匀的片状铜粉,可提高MLCC端头的致密性,提升其耐焊接热能力;选用Zn-B-Si作为玻璃体系,对片容的耐焊接热具有明显的改善作用;在端头不被氧化的前提下,烧端工序充足的氧含量对改善耐焊接热具有积极作用。通过以上改进,在实际生产中RSH失效率已由改进前的100×10–6以上降到了5×10–6以下。
|
| 关 键 词： | 电子技术 Ni/Cu MLCC 铜端浆 粒径 耐焊接热 |
| 文章编号： | 1001-2028(2005)08-0060-03 |
Study on the Reason Influenced of Failure of RSH in Ni/Cu Electrode Y5V MLCC |
| |
| QI Kun,LAI Yong-xiong,LI Ji-sen. Study on the Reason Influenced of Failure of RSH in Ni/Cu Electrode Y5V MLCC[J]. Electronic Components & Materials, 2005, 24(8): 60-62 |
| |
| Authors: | QI Kun LAI Yong-xiong LI Ji-sen |
| |
| Abstract: | The effect of Cu paste and different firing processes on RSH in Ni/Cu Y5V MLCC was studied. The results show that small size and uniform flake Cu powder can improve the compactness of the end, which can improve the RSH; Zn-B-Si glass system can improve the RSH in evidence; enough oxygen can prevent carben aggradation before the termination was oxygenated, which has positive function in improving RSH.The ratio of failure of RSH has improved from more than 100 ×10–6 to less than 5×10–6 after being improved above all in the production. |
| |
| Keywords: | Ni/Cu MLCC |
| 本文献已被 CNKI 万方数据 等数据库收录！ |
|
