| Affiliation: | 1. ARCES-DEI, University of Bologna, Cesena, Italy;2. DTG, University of Padova, Vicenza, Italy;3. Technology R&D, STMicroelectronics, Agrate Brianza, Italy;1. School of Semiconductor and Chemical Engineering, Semiconductor Physics Research Center, Chonbuk National University, Jeonju 561-756, Republic of Korea;2. Division of Material Science, Korea Basic Science Institute, Daejeon 305-806, Republic of Korea;3. Department of Nano-Optical Engineering, Korea Polytechnic University, Siheung 429-793, Republic of Korea;4. Electronics & Telecommunication Research Institute (ETRI), Daejeon 305-700, Republic of Korea;1. Department of Electronic Materials Engineering, Kwangwoon University, 20 Kwangwoon-ro, Nowon-gu, Seoul 01897, Republic of Korea;2. Material Technology Center, Korea Testing Laboratory, 87 Digitalro 26-gil, Guro-gu, Seoul 152-718, Republic of Korea;3. Department of Electrical Engineering, Chosun University, 309 Pilmun-daero, Dong-gu, Gwangju 61452, Republic of Korea;4. Department of Chemical Engineering, Kwangwoon University, 20 Kwangwoon-ro, Nowon-gu, Seoul 01897, Republic of Korea;1. Institute of Technology and Science, Tokushima University, Tokushima, 770-8506, Japan;2. School of Electronics and Information Technology, Sun Yat-Sen University, Guangzhou, 510275, People''s Republic of China |
