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镀铜CF/ABS树脂复合材料的导电性能
引用本文:周娩红,陈石林,杨建校,郭建光.镀铜CF/ABS树脂复合材料的导电性能[J].材料导报,2018,32(10):1592-1596.
作者姓名:周娩红  陈石林  杨建校  郭建光
作者单位:湖南大学材料科学与工程学院,长沙,410082
基金项目:国家自然科学基金(51472082)
摘    要:通过在中间相沥青基炭纤维表面化学镀铜以提高纤维导电性能,并以热压法制备了短切镀铜炭纤维(Cu-CF)增强ABS树脂导电复合材料。采用SEM、EDS、XRD等表征方法研究了Cu-CF的镀层厚度、Cu-CF界面结构,以及镀铜厚度和Cu-CF的含量对复合材料导电性能的影响。研究表明,化学镀铜是铜晶粒不断长大与晶体结构更加致密的过程。Cu-CF的界面粘结受镀层厚度的影响,随着镀层厚度的增加,镀层与纤维之间出现间隙。Cu-CF的电阻率随镀层厚度的增加急剧降低,当镀层厚度增大至695nm后电阻率趋于稳定。采用镀层厚度为632nm的Cu-CF为增强相,当其体积含量为20%时,Cu-CF/ABS复合材料的电阻率为5.87×10-4Ω·cm,在导电功能材料领域具有很好的应用前景。

关 键 词:炭纤维  复合材料  化学镀铜  微观结构  导电性  carbon  fiber  composites  electroless  copper  plating  microstructure  electrical  conductivity

Electrical Conductivity of Copper-coated CF/ABS Composites
ZHOU Mianhong,CHEN Shilin,YANG Jianxiao and GUO Jianguang.Electrical Conductivity of Copper-coated CF/ABS Composites[J].Materials Review,2018,32(10):1592-1596.
Authors:ZHOU Mianhong  CHEN Shilin  YANG Jianxiao and GUO Jianguang
Affiliation:College of Material Science and Engineering, Hunan University, Changsha 410082,College of Material Science and Engineering, Hunan University, Changsha 410082,College of Material Science and Engineering, Hunan University, Changsha 410082 and College of Material Science and Engineering, Hunan University, Changsha 410082
Abstract:The copper-coated mesophase pitch-based carbon fibers (Cu-CF)were prepared by electroless copper plating for im-proving the conductivity of CF,and the Cu-CF reinforced ABS resin (Cu-CF/ABS)composites were prepared using hot-pressed method.The surface morphology and microcrystalline structure of Cu-CF were characterized by SEM,EDS and XRD.The relation-ship between the thickness of copper layers as well as the interface structure of Cu-CF and the conductivity of composites was investi-gated.The results showed that the electroless copper plating was a grain size growing and crystal structure compacting process for achieving copper layers on the surface of carbon fiber.The resistivity of the Cu-CF decreased rapidly as increasing the thickness of copper layers,and the resistivity of the Cu-CF slowed to a constant level when the thickness of copper layers over 695 nm.Moreo-ver,the Cu-CF/ABS composites presented excellent conductivity of 5.87×10-4 Ω·cm when the resultant Cu-CF (thickness of 632 nm)used as strengthening phases with volume fraction of 20%.Therefore,the Cu-CF/ABS composites showed a great potential ap-plication for conductive functional materials.
Keywords:carbon fiber  composites  electroless copper plating  microstructure  electrical conductivity
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