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Tribological and electrical properties of nanocrystalline Cu films deposited by DC magnetron sputtering with varying temperature
Affiliation:1. Department of Ceramic Technology, Anna University, Chennai 600025, India;2. Indira Gandhi Centre for Atomic Research, Kalpakkam 603102, Tamil Nadu, India;3. Centre for Nanoscience and Technology, Anna University, Chennai 600025, India;1. Department of Materials Science and Engineering, Hongik University, Sejong 339-701, South Korea;2. Center of Research Excellence in Nanotechnology, King Fahd University of Petroleum and Minerals, Dhahran 31261, Saudi Arabia;1. Hydrogen Energy Centre, Department of Physics, Institute of Science, Banaras Hindu University, Varanasi, 221005, India;2. Department of Materials Science and NanoEngineering, Rice University, Houston, TX, USA;1. Department of Mechanical Engineering, Faculty of Engineering, South Tehran Branch Islamic Azad University, Tehran, Iran;2. School of Metallurgical and Materials Engineering, College of Engineering, University of Tehran, Tehran, Iran;1. CICECO, Department of Materials and Ceramic Engineering, University of Aveiro, 3810-193 Aveiro, Portugal;2. I3N, Physics Department, University of Aveiro, 3810-193 Aveiro, Portugal;3. Materials Metrology Division, INMETRO, 25250-020 Duque de Caxias, RJ, Brazil
Abstract:Cu films were deposited on Si substrates by direct current (DC) magnetron sputtering at three different substrate temperatures such as room temperature (RT), 100 °C and 200 °C. Possible mechanisms for substrate temperature dependent microstructure evolution in Cu films are discussed in this paper. Enhanced mechanical properties such as high hardness, high elastic modulus, low friction coefficient and high wear resistance of the films were obtained at deposition temperature of 100 °C. However, high friction coefficient as well as high wear rate was measured in films deposited at room temperature and 200 °C.
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