| 3D AOI应对焊膏印刷的新挑战 |
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| 引用本文： | 鲜飞. 3D AOI应对焊膏印刷的新挑战[J]. 印制电路信息, 2007, 0(10): 67-69 |
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| 作者姓名： | 鲜飞 |
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| 作者单位： | 烽火通信科技股份有限公司,湖北,武汉,430074 |
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| 摘 要： | 高密度封装技术的飞速发展也给焊膏印刷检测技术提出了新挑战。为了应对挑战,新的检测技术不断涌现,3DAOI就是其中之一,它能测量焊膏的高度、面积和体积,有效控制焊膏印刷质量。文中扼要的介绍3DAOI检测的原理及应用,指出了3DAOI是保证电子组装质量的必要手段。
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| 关 键 词： | 焊膏印刷 检测 |
| 文章编号： | 1009-0096(2007)10-0067-03 |
3D AOI Replies the New Challenge in Solder Paste Printing |
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| Xian Fei. 3D AOI Replies the New Challenge in Solder Paste Printing[J]. Printed Circuit Information, 2007, 0(10): 67-69 |
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| Authors: | Xian Fei |
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| Abstract: | The rapid development of high density packaging technology has already bring up the new challenge to inspection technology for solder paste printing. For replying challenge, the new inspection technology continu- ously appears, 3D AOI inspection is one of them, it can be used to measure the height, area and volume of solder paste, and effectively controls quality of solder paste printing. This paper simply introduces the theory and the application of 3D AOI inspection, indicates that 3D AOI inspection is necessary method to guarantee the quality of electronics assembly. |
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| Keywords: | 3D AOI |
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