Study on High-power LED Heat Dissipation Based on Printed Circuit Board |
| |
| Authors: | WANG Yiwei ZHANG Jianxin NIU Pingjuan LI Jingyi |
| |
| Affiliation: | WANG Yiwei1,ZHANG Jianxin1,NIU Pingjuan1,LI Jingyi2(1.School of Information and Communication Engineering,Tianjin Polytechnic University,Tianjin 300160,CHN,2.Tianjin Gongda HiYu Solid State Lighting Co,Ltd.Tianjin 300160,CHN) |
| |
| Abstract: | In order to study the role of printed circuit board(PCB)in high-power LED heat dissipation,a simple model of high-power LED lamp was designed.According to this lamp model,some thermal performances such as thermal resistances of four types of PCB and the changes of LED junction temperature were tested under three different working currents.The obtained results indicate that LED junction temperature can not be lowered significantly with the decreasing thermal resistance of PCB.However,PCB with low thermal res... |
| |
| Keywords: | high-power LED printed circuit board(PCB) substrate of heat dissipation thermal resistance junction temperature |
| 本文献已被 CNKI 等数据库收录！ |
|
