Insulation enhancement with heat-shrinkable components |
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| Authors: | Hoffman J.W. |
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| Affiliation: | Raychem Corp., Menlo Park, CA; |
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| Abstract: | The basic performance requirements for heat-shrinkable components and the compounding and processing techniques that are used to meet these requirements are covered. The emphasis is on the electrical, mechanical, and environmental protection features of components for low-voltage (up to 1 kV) applications. The aim is to provide a fundamental understanding of the capabilities and applications of heat-shrinkable components for insulation enhancement and environmental protection of electrical systems. Cross-linking, polymer selection, compounding, manufacturing, sealants, installation, and product configurations are discussed |
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