| Influence of stress on the creep behavior of Cu particle enhancement SnPb based composite solder joints |
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| 作者姓名： | YAN Yanfu YAN Hongxing CHEN Fuxiao ZHANG Keke ZHU Jinhong |
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| 作者单位： | School of Materials Science and Engineering, Henan University of Science and Technology, Luoyang 471003, China |
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| 基金项目： | This study is financially supported by the Foundation of Henan University of Science ＆ Technology 6No.13420060） and Luoyang Advanced Hydraulic Pressure Technology Ltd （6142004）. |
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| 摘 要： | 1. Introduction Mechanical fracture of solder joints is a major cause of failure and it decreases the reliability in electronic systems. With the increased functionality, miniaturization of electronic components, broad op-eration temperature ranges, and increased stress re-quirement, good mechanical properties are de-manded on solder joints. The eutectic tin-lead solder, which has a low melting point (183°C), plays an important role in SMT (surface mount technology). The working temperature…
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| 关 键 词： | 铜粒子增强 锡铅基复合物焊料 焊接接头 蠕变行为 应力 |
| 收稿时间： | 2006-01-05 |
Influence of stress on the creep behavior of Cu particle enhancement SnPb based composite solder joints |
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| YAN Yanfu YAN Hongxing CHEN Fuxiao ZHANG Keke ZHU Jinhong.Influence of stress on the creep behavior of Cu particle enhancement SnPb based composite solder joints[J].Rare Metals,2007,26(1):51-55. |
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| Authors: | YAN Yanfu YAN Hongxing CHEN Fuxiao ZHANG Keke ZHU Jinhong |
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| Affiliation: | 1. School of Metallurgical and Materials Engineering, College of Engineering, University of Tehran, Tehran, Iran;2. Department of Materials Engineering, South Tehran Branch, Islamic Azad University, Tehran, Iran;1. Physics Department, Faculty of Science, Zagazig Univ., Zagazig, Egypt;2. Physics Department, Faculty of Science, Islamic Univ. of Gaza, Gaza, Palestine |
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| Abstract: | Lap joints with a 1 mm^2 cross-sectional area were fabricated using Cu particle enhancemem 63Sn37Pb based composite solder and 63Sn37Pb eutectic solder to examine the influence of stress on the creep behavior of the solder joints. The results indicate that the creep resistance of the composite solder joints is generally superior to that of the conventional 63Sn37Pb solder joints. At the same time, the creep rupture life of the composite solder joints is declined with increasing stress and drops faster than that of the 63Sn37Pb eutectic solder joints. |
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| Keywords: | composite solder stress creep rupture life particle-enhancement 63Sn37Pb |
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