| HDI多层板覆铜箔板生产技术的应用与开发 |
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| 引用本文： | 刘宏. HDI多层板覆铜箔板生产技术的应用与开发[J]. 铜业工程, 2009, 0(2): 27-29 |
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| 作者姓名： | 刘宏 |
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| 作者单位： | 铜陵有色股份铜材有限公司,安徽,铜陵,244003 |
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| 摘 要： | 介绍了电解铜箔的技术发展方向,着重介绍覆铜箔板生产的发展历程和产品的技术开发与应用。
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| 关 键 词： | 铜箔 覆铜箔板 HDI多层板 印制电路板 |
Application and Development of HDI Multi-layer Laminated Copper Foil Production Technology |
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| LIU Hong. Application and Development of HDI Multi-layer Laminated Copper Foil Production Technology[J]. Copper Engineering, 2009, 0(2): 27-29 |
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| Authors: | LIU Hong |
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| Affiliation: | LIU Hong ( Tonglin Non-ferrous Copper Procucts Co. Ltd. , Tongling 244003, Anhui, China) |
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| Abstract: | This article introduces the development direction of eleetrodeposited copper foil production technology, focusing on development history of copper foil laminates, product technology development and application. |
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| Keywords: | Copper foil copper foil laminators HDI multilayer laminats printed circuit board |
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