| MEMS技术现状与发展前景 |
| |
| 引用本文： | 谷雨. MEMS技术现状与发展前景[J]. 电子工业专用设备, 2013, 0(8): 1-8,49 |
| |
| 作者姓名： | 谷雨 |
| |
| 作者单位： | 美国加洲大学洛杉矶分校 |
| |
| 摘 要： | 介绍了微电子机械系统（MEMS）技术的发展现状、加工工艺及产品市场。结合MEMS材料与加工技术，讨论了MEMS产品的封装技术及存在的问题，展望了MEMS技术的发展前景。
|
| 关 键 词： | 微电子机械系统 代工厂 MEMS工艺 MEMS封装技术 |
MEMS Technology Status and Development Prospects |
| |
| GU Yu. MEMS Technology Status and Development Prospects[J]. Equipment for Electronic Products Marufacturing, 2013, 0(8): 1-8,49 |
| |
| Authors: | GU Yu |
| |
| Affiliation: | GU Yu(University of California,Los Angeles,USA) |
| |
| Abstract: | The development status, processing technologies and product markets of Micro Electro Mechanical Systems （MEMS） technology are introduced. The packaging technology and existing problems of MEMS product are mainly discussed, combining the MEMS materials and processing techniques, and the development prospects of MEMS technology are prospected. |
| |
| Keywords: | MEMS （Micro Electro Mechanical Systems） Foundries MEMS process MEMS packagingtechnologies |
| 本文献已被 CNKI 维普 等数据库收录！ |
