MEMS packaging process by film transfer using an anti-adhesive layer |
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Authors: | Sebastien Brault O Garel G Schelcher N Isac F Parrain A Bosseboeuf F Verjus M Desgeorges and E Dufour-Gergam |
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Affiliation: | (1) Institut d’Electronique Fondamentale, UMR CNRS 8622, Universit? Paris Sud-11, B?t.220, 91405 Orsay Cedex, France;(2) KFM Technology, 11 Avenue de Norv?ge, 91140 Villebon sur Yvette, France |
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Abstract: | A low cost and low temperature thin film packaging process based on the transfer of an electroplated Nickel 3D cap is proposed.
This process is based on adhesion control of a thick molded cap Ni film on the carrier wafer by using a plasma deposited fluorocarbon
film, on mechanical debonding and on adhesive bonding of the microcaps on the host wafer with BCB sealing rings. Mechanical
characterizations show that the transferred microcaps have a high stiffness, a low stress and a high adhesion. Because this
process is simple and only involves a low temperature (250°C) heating of the host wafer, it is highly versatile and suitable
for the encapsulation of micro and nano devices, circuits and systems elaborated on a large range of substrate materials. |
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