硅溶胶改性紫外光固化环氧丙烯酸酯胶黏剂的研究

以正硅酸乙酯（TEOS）为无机前驱体,γ-甲基丙烯酰氧丙基三甲氧基硅烷（KH-570）为偶联剂,HCl为催化剂,采用溶胶-凝胶（Sol-Gel）法制得了硅溶胶,并以此硅溶胶对自制的紫外光固化环氧丙烯酸酯（EA）胶黏剂进行改性。通过傅立叶红外光谱（FT-IR）表征了EA的结构,通过热分析以及力学性能测试表征了此复合胶黏剂的热性能以及力学性能。结果表明：硅溶胶的加入显著地提高了环氧丙烯酸酯胶黏剂的耐高低温性能以及热稳定性,当硅溶胶的固体质量为体系总质量的40%时,复合胶黏剂在-196℃、室温、100℃的拉伸剪切强度分别提高了600%、320%、400%;热分解温度提高了50℃。

Study on the Modification of UV-curable Epoxy Acrylate Adhesive by Silica Sol

The silica sol was prepared by the sol-gel process with using tetraethoxysilane（TEOS） as inorganic precursor,3-methacryloxypropyltrimethoxysilane（KH-570） as coupling agent,hydrochloric acid（HCl） as catalyst.The UV-curable epoxy acrylate adhesive was modified by the prepared silica sol.The structures of EA were characterized by FT-IR.The thermal and mechanical property of the composite adhesive were studied by TG and tensile shear strength test,the result showed that its＇ heat resistance and bonding strength at high and low temperature were improved remarkably.When the mass of solid content of silica sol reached 40%,the composite adhesive＇s tensile shear strength at -196℃,room temperature and 100℃ was improved by 600%,320% and 400% respectively,and the thermal decomposition temperature was improved by 50℃