| Cu中间层SiCp/Al MMCs TLP扩散连接过程分析 |
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| 引用本文： | 张剑锋,姜世杭,金朝阳,王笃雄.Cu中间层SiCp/Al MMCs TLP扩散连接过程分析[J].焊接技术,2005,34(1):12-14. |
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| 作者姓名： | 张剑锋 姜世杭 金朝阳 王笃雄 |
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| 作者单位： | 扬州大学,机械工程学院,江苏,扬州,225009 |
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| 基金项目： | 江苏省教育厅资助项目(F0109190) |
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| 摘 要： | 采用铜箔作中间层,在连接温度为853 K、无压的条件下进行了瞬间液相连接,对TLP扩散连接过程及其动力学模型进行了分析,并对试验结果进行了的验证.结果表明TLP扩散连接理论模型和试验结果之间还存在着一些差异,对等温凝固过程还需要进一步探讨.分析认为,AlMMCs中大量的晶界、亚晶界、位错等短路扩散通道的存在,直接影响TLP连接过程及其动力学.
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| 关 键 词： | 铝基复合材料 瞬间液相连接 过程分析 |
| 文章编号： | 1002-025X(2005)01-0012-03 |
| 修稿时间： | 2004年8月13日 |
Analysis of process of SiCp/Al MMCs TLP diffusion and bonding with Cu interlayer |
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| ZHANG Jian-feng,JIANG Shi-hang,JIN Zhao-yang,et al..Analysis of process of SiCp/Al MMCs TLP diffusion and bonding with Cu interlayer[J].Welding Technology,2005,34(1):12-14. |
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| Authors: | ZHANG Jian-feng JIANG Shi-hang JIN Zhao-yang |
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| Abstract: | Transient liquid phase (TLP) bonding joints have been produced with copper interlayer when without press bonded at 853 K. TLP diffusion bonding process mechanisms and dynamic model have been discussed and compared with the experiment results. The results showed that there were some differences between the TLP diffusion and bonding theory models and experiment results, and the isothermal solidification process should be further investigated. It indicated that great diffusion channel such as along grain boundaries, sub-grain boundaries and dislocation among Al MMCs directly affected the progress of TLP bonding and dynamics. |
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| Keywords: | aluminium metal composites instantaneous transient liquid phase bonding analysis of TLP bonding process |
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