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Representation of the SiGe HBT's thermal impedance by linear and recursive networks
Authors:Hassne Mnif  Thomas Zimmer  Jean Luc Battaglia  Sbastien Fregonese
Affiliation:a Laboratoire de Microélectronique IXL, UMR 5818, University of Bordeaux I, 33405, Talence, France;b LEPT, ENSAM, Esplanade des Arts et Métiers, 33405, Talence, France
Abstract:In this paper, new methods for approximating the thermal spreading impedance of SiGe HBT devices with electrical equivalent circuits are presented. The electrical equivalent circuits permit an accurate representation of the fractional behavior of the thermal impedance. Using these equivalent circuits, the thermal model can be implemented in electrical SPICE type simulators.
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