| 可挠性PCB和电镀通孔：挑战与解决方法 |
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| 引用本文： | 丁志廉.可挠性PCB和电镀通孔：挑战与解决方法[J].印制电路信息,2006(9):43-47. |
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| 作者姓名： | 丁志廉 |
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| 摘 要： | 概述了挠性和刚-挠性板的前处理工艺。等离子态去钻污费时和成本高,采用改进的前处理的化学镀铜可以满足挠性印制电路(FPC)大生产的要求。
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| 关 键 词： | 挠性印制电路 等离子体去钻污 化学镀铜 清洁剂 还原剂 粘结力 |
Flexible PCBs and Plating Through Holes:Challenges and Solution |
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| Ding Zhilian.Flexible PCBs and Plating Through Holes:Challenges and Solution[J].Printed Circuit Information,2006(9):43-47. |
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| Authors: | Ding Zhilian |
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| Affiliation: | Ding Zhilian |
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| Abstract: | This paper describes the pre-treatment process of flex and rigid-flex.Due to the time and expense of using plasma desmear there is a lot of pre-treatment to generate a suitable electroless copper solution for FPC mass production. |
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| Keywords: | FPC plasma desmear electroless copper cleaner reducer adhesion |
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