Fabrication and Characterization of High-Bonding-Strength Al/Ti/Al-Laminated Composites via Cryorolling |
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| Authors: | Juan Liu Yuze Wu Lin Wang Hui Wang Charlie Kong Alexander Pesin Alexander P Zhilyaev Hailiang Yu |
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| Affiliation: | State Key Laboratory of High Performance Complex Manufacturing, Central South University, Changsha 410083,China;College of Mechanical and Electrical Engineering, Central South University, Changsha 410083, China;Light Alloys Research Institute, Central South University,Changsha 410083, China;Research Center for Advanced Science and Technology, The University of Tokyo, Meguro, Tokyo 1530041, Japan;Mark Wainwright Analytical Centre, University of New South Wales, Sydney, NSW 2052, Australia;Laboratory of Mechanics of Gradient Nanomaterials, Nosov Magnitogorsk State Technical University, Magnitogorsk,Russia 455000 |
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| Abstract: | Sandwich-like Al/Ti/Al-laminated composites have many advantages such as low density and high specific strength with value in mechanical manufacturing and aerospace engineering. Here, Al/Ti/Al-laminated composites were fabricated by hot roll bonding and subsequent processes: cryorolling (- 190 °C and - 100 °C), cold rolling (25 °C), and hot rolling (300 °C). Their bonding strength and mechanical properties were then studied by an Autograph AGS-X universal electronic testing machine. The results show that cryorolling can improve the interface bonding strength and tensile strength of Al/Ti/Al-laminated composites. For the Al/Ti/Al-laminated composites subjected to cryorolling at - 100 °C, they have the highest strength near 260 MPa—this is 48 MPa and 41 MPa higher than the laminated composites subjected to cold and hot rolling, respectively. These results also show the strongest peeling strength. Finally, the mechanisms of the enhancement of bonding strength and mechanical properties of Al/Ti/Al-laminated composites subjected to cryorolling were mainly discussed. |
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| Keywords: | Laminated composites Cryorolling Bonding strength Peeling strength Mechanical property Bonding mechanism |
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