SMC模压过程非稳态温度场数值模拟

SMC模压成型过程固化度与温度是强耦合关系，为了对SMC模压成型过程非稳态温度场与固化度进行数值模拟，依据固化动力学和非稳态导热理论，建立了温度场和固化度动力学模型。通过DSC试验分析确定模型中固化度动力学参数。利用有限单元与有限差分相结合的方法，建立了温度场和固化度数值模型。应用Euler逐步迭代法实现了计算机解耦，数值模拟与试验比较，结果吻合，为优化模压成型工艺提供了理论依据。

Numerical simulation of unstable temperature field during modeling of SMC

The relation between dynamic changes of curing degree and temperature is intensively coupled during the modeling process of SMC. In order to carry out a numerical simulation of the unstable temperature field and curing degree in the modeling SMC process, a mathematical model has been established for the variation of temperature distribttion and curing degree on the basis of curing kinetic and unstable thermal conduction theories. Kinetics parameters based on the models are determined by using differential scanning calorimetry(DSC).An numerical model has been established for the temperature and curing degree by combining two dimensional finite element with finite differental, and the coupled question was solved by using Euler step-by-step iterative method. The computer code was worked out and the result of the numerical simulation corresponds well to the test result, which provides a theoretical basis for optimizing process parameter.