光纤耦合模块中光纤焊接技术的研究

大功率半导体激光器列阵的光纤耦合模块对光纤焊接的要求很高,在焊接避免使用有机粘接剂和有助焊剂的金属焊膏,因为其在激光器工作时易挥发出有机物质。这些有机物会污染激光器腔面,致使激光器工作时腔面温度过高。附着在腔面的有机物就会被碳化,影响激光器的出光率,甚至还会导致激光器烧毁。文章介绍用电场辅助焊接的方法,使光纤在硅片的V型槽中固定,在焊接中不使用助焊剂和有机粘接剂,取得了良好效果,减少了激光器腔面的污染,从而提高了半导体激光器光纤耦合模块的寿命。测试结果表明,剪切强度最大可达35MPa。

Study of Optical Fiber Bonding Technology in Optical Fiber Coupling Modules

Optical fiber coupling modules for high-power semiconductor laser arrays has many requirements of optical fiber welding. Organic adhesives and soldering paste with flux are not used in bonding as organic volatilization occurs in laser operation. These organisms will pollute laser cavities and lead to high temperature of laser cavities. Organisms adhered to laser cavities will carbonize, thus affects laser emission and cause burning of lasers. A method of field-assisting bonding is introduced to fix optical fibers in v-shaped grooves of silicon wafers. The method proves to be effective because flux and organic adhesives are not used in bonding, thus lessens pollution of laser cavities and further lengthens the lifetime of optical fiber coupling modules for semi- conductor lasers. The result of the test showed that the maximum shear reached 35MPa.