The influence of environmental fluids and temperature on the cut-surface morphology of single-crystal silicon

Single-crystal (Cz) silicon wafers (100) p-type] were cut in air, d6onked (DI) water and ethanol, at room temperature, 150 and 200°C by a diamond impregnated dicing wheel using a specially designed apparatus. The effects of environmental fluids and temperature on the cut surface morphology were examined by scanning electron microscopy (SEM). The SEM investigation showed that gouging and ploughing is predominant when silicon is cut in DI water or ethanol. Debris size analysis showed that the mean diameter of the volume distribution (MV) of debris formed in ethanol at room temperature was 9.5 m while that formed in air was 1.3 m. The surface morphology is significantly different at 150 and 200° C as compared to room temperature, i.e. the width of individual wear tracks varied from 0,8 m for room temperature to 1.6 m for 200° C.